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Foundry

Advanced Packaging: Intel's EMIB vs TSMC's CoWoS
Is Intel's EMIB better than TSMC's CoWoS for AI accelerators? A primer on both, an honest look at the trade-offs, and where it goes from here.
 • Austin Lyons
TSMC's Margins in Uncharted Territory
66.2% in the weakest quarter of the year. The biggest sequential jump on record. And 10 points above the long-term target they just raised.
 • Austin Lyons
Substrate
X-ray lithography worked. The industry chose a different path. Substrate wants to go back. Here's why.
 • Austin Lyons
xLight. Photons as a Service.
xLight's plan to swap EUV's light source for a free-electron laser and sell light like a utility.
 • Austin Lyons
Intel Q425: Back to Reality
Continued supply constraints, advanced packaging timing, and why Q1 2026 will be more of the same
 • Austin Lyons
Lithography Economics
The Problem With Lithography. ASML, xLight, Substrate.
 • Austin Lyons
Intel is "All In On 14A"
Takes from Intel at RBC's TIMT conference
 • Austin Lyons
Understanding SkyWater
Deep Dive on $SKYT
 • Austin Lyons
Intel Q3 2025 Earnings: Doing Fine
18A Progress, 14A Gambit Worked, Supply and Demand Problems
 • Austin Lyons
TSMC Earnings and Intel Foundry
Record revenues, accelerating demand, and what it means for Intel Foundry
 • Austin Lyons
Intel’s 18A: Misstep or First Step?
RibbonFET, PowerVia, Foundry Roadmap, Reuters Write-off, Comparing TSMC
 • Austin Lyons
Intel Foundry’s Cultural Reboot
Rebooting from the outside in. Naga & Kevin showcase cultural progress at Direct Connect 2025.
 • Austin Lyons
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