Chiplets & Packaging

Power Moves Into the Package. Empower, PowerLattice, and the IVR Socket

Why did ADI agree to pay $1.5B for Empower Semi? Because XPUs are about to draw 3,000+ amps at 0.7V. Transients and I²R both blow up. Move the regulator…

May 27 • Austin Lyons

Advanced Packaging: Intel's EMIB vs TSMC's CoWoS

Is Intel's EMIB better than TSMC's CoWoS for AI accelerators? A primer on both, an honest look at the trade-offs, and where it goes from here.

May 12 • Austin Lyons

An Interview With Mohamed Awad About Chiplets

Arm's Chiplet Ecosystem Announcement

Oct 15, 2025 • Austin Lyons

Building the Chiplet Ecosystem

Arm’s CSA, Neoverse CSS, and Total Design as a framework for multi-vendor chiplet ecosystem alignment

Aug 20, 2025 • Austin Lyons

Eliyan: The Ultimate Chiplet Interconnect

Backed by Every Major HBM and Foundry, Built by Networking Pioneers

Aug 15, 2025 • Austin Lyons

Chiplets and the Future of System Design

How chiplets keep integration scaling alive. Benefits, trade-offs, and the need for open standards.

May 29, 2025 • Austin Lyons

The Long Arc of Semiconductor Scaling

The journey from vacuum tubes to transistors, from small ICs to billion-transistor SoCs. Setting the stage for chiplets.

May 10, 2025 • Austin Lyons

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