Research / Topics
Chiplets & Packaging
Advanced packaging and the chiplet ecosystem. CoWoS, EMIB, die-to-die interconnect and the economics of disaggregated design.
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2026
- A Billion Agents Need Somewhere to Run
Grok Bot, Meta Muse, and what consumer adoption means for CPUs, accelerators, memory, and advanced packaging.
- Power Moves Into the Package. Empower, PowerLattice, and the IVR Socket
Why did ADI agree to pay $1.5B for Empower Semi? Because XPUs are about to draw 3,000+ amps at 0.7V. Transients and I²R both blow up. Move the regulator into the substrate. ADI, MPWR, VICR, IFNNY, AMK
- Advanced Packaging: Intel's EMIB vs TSMC's CoWoS
Is Intel's EMIB better than TSMC's CoWoS for AI accelerators? A primer on both, an honest look at the trade-offs, and where it goes from here.
2025
- An Interview With Mohamed Awad About Chiplets
Arm's Chiplet Ecosystem Announcement
- Building the Chiplet Ecosystem
Arm’s CSA, Neoverse CSS, and Total Design as a framework for multi-vendor chiplet ecosystem alignment
- Eliyan: The Ultimate Chiplet Interconnect
Backed by Every Major HBM and Foundry, Built by Networking Pioneers
- Chiplets and the Future of System Design
Benefits and trade-offs, and the need for standards and an open ecosystem
- The Long Arc of Semiconductor Scaling
The journey from vacuum tubes to transistors, from small ICs to billion-transistor SoCs. Setting the stage for chiplets.
